Automation


The DPAC-3000 from ADLINK Technology Inc. is a compact embedded controller for the machine automation industry that offers a distributed control solution for digital and analog I/O and motion control. The controller reduces cabling required by 15% to 20% compared to other Programmable Logic Controller (PLC) and Programmable Automation Controller (PAC) solutions.

Equipped with a fast, time-deterministic fieldbus, the standalone DPAC-3000 allows faster installation and comes in a cost-effective and compact form factor. The controller features a rugged embedded platform with a front control panel for system integrators to design their own user control interface, which can be used for a variety of applications, including monitoring purposes, and parameter setting and checking.

The controller features a high shock endurance up to 100G. The company’s DPAC product line features well-integrated motion, I/O, and communications functionality. The DPAC-3000 series combines embedded PC technology and distributed I/O modules to form a compact, vertically mountable, and highly-extendable PAC solution. The controller supports configurations based on the AMD Geode LX800 and Intel Celeron M. The DPAC-3000 will be available on April 30.

 
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The modular world of DIAS is multifaceted and opens up almost inexhaustible possibilities. During development, weconcentrate on simple, flexible, safe, inexpensive and, most of all, extremely fast solutions.

Our I/O systems are available in three different series: DIAS, C-DIAS and P-DIAS. All of these product series can be implemented in a modular or decentralized configuration and make a strong impression with their compact design and flexibility. The different series can be combined as desired.

SIGMATEK’s extensive experience has bred a multitude of standard modules.

Highlights DIAS series:
- I/O stations consist of a terminal block and a function module
- Easy exchange of function modules, without having to disconnect the block wiring
- 3-wire connection technology
- Compact design

Highlights C-DIAS series:
- Highly compact design with high package density
- Individual modules simply plugged onto the module carrier
- Fast and simple wiring
- Use of prefabricated cables with connectors
- Comfortable exchange of individual modules

Highlights P-DIAS Series:
- IP67 protection
- Compatible with all other component series
- Time saving connection technology

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